Swiss embedded computing specialist Toradex has announced the launch of two new computer-on-module (COM) families, named OSM and Lino, which are targeted at the industrial automation and Internet of Things (IoT) sectors. This release underscores the company’s commitment to providing compact and reliable solutions for industrial edge AI computing.
“Both families deliver new compact, reliable, industrial edge AI compute platforms,” said Samuel Imgrueth, CEO of Toradex. He noted that while the OSM series integrates a solderable standard form factor, the Lino family offers connector-based ease of use for rapid integration and serviceability. This development aims to empower customers to design next-generation, intelligent, space-constrained devices with confidence, scalability, and long-term support.
The OSM family adheres to the Open Standard Module specification, Size-S variant, allowing for a compact design that measures just 30×30mm (approximately 1.18×1.18″). It features a ball grid array (BGA) footprint for direct soldering onto a host carrier board. In contrast, the Lino family maintains the same dimensions but employs dual 100-pin board-to-board connectors underneath, enabling easy removal from its carrier board for straightforward replacement.
Both the OSM and Lino formats share the same core hardware, starting with the base-level model, either the Lino or OSM iMX91, which is built around the NXP Semiconductors i.MX 91 system-on-chip. This model features a single Arm Cortex-A55 core capable of running at speeds up to 1.4GHz, along with up to 2GB of LPDDR4 RAM and 16GB of eMMC flash that can be expanded to 256GB. For users requiring enhanced performance, the Lino or OSM iMX93 variant is available, equipped with the NXP i.MX 93, which includes two Cortex-A55 cores operating at up to 1.7GHz, a companion real-time Cortex-M33 core running at up to 250MHz, and an optional neural coprocessor that offers 0.5 tera-operations per second (TOPS) for on-device machine learning and AI tasks.
To further facilitate integration, Toradex has introduced the Verdin-Lino adapter. This interstitial board accepts a Lino COM and adapts it to the SODIMM form factor of the company’s previous Verdin COMs, allowing Lino to function as a drop-in upgrade. On the software front, Toradex provides a Yocto reference Linux image and offers support for its proprietary Torizon platform.
With the launch of the OSM and Lino families, Toradex is poised to enhance the capabilities of developers and engineers working on IoT and industrial automation projects. The introduction of these advanced computing solutions highlights the growing demand for efficient and flexible computing platforms in an increasingly interconnected world, signaling the company’s strategic focus on meeting the evolving needs of the market.
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