Neo and SpoonOS have announced Tokyo as the next destination on the Scoop AI Hackathon global tour, marking the sixth event in this series that explores the intersection of blockchain and artificial intelligence. Scheduled for January 31, 2026, the Tokyo Bowl will be held at MIDORI.so Shibuya / CryptoBase, featuring a one-day, idea-focused hackathon format.
In collaboration with CreatorLabo and Tokyo Design Community, the Tokyo Bowl aims to engage developers, creators, and newcomers alike in exploring the Scoop AI theme through presentations and concept-driven projects. The event will be conducted entirely offline, with technical support from SpoonOS available throughout the day.
Participants are invited to submit slide-based presentations instead of fully developed products. While working demos are encouraged and may garner additional points, they are not a prerequisite for judging. The event will follow a structured agenda, including registration, team formation, talks, lunch, ideation, presentations, and awards.
The total prize pool for the Tokyo Bowl is US $1,000, allocated as follows: a grand prize of $300, two excellence awards of $200 each, and three honorable mentions worth $100 each. Catering and refreshments will be provided on-site for all participants.
The Scoop AI Hackathon series is a global initiative organized by Neo and SpoonOS, focused on investigating how AI and Web3 technologies can facilitate a “sentient economy”—a decentralized system characterized by autonomous agents, transparency, and trustless execution. The Tokyo event follows recent hackathons held in Moscow, Hanoi, London, Silicon Valley, and Seoul, with future events planned in Hyderabad and Beijing.
This series boasts a total prize pool of US $100,000, with each city presenting its unique structure, challenge tracks, and awards. Participants can access event guidelines, SDKs, TestNet information, and additional resources in the official Scoop AI Hackathon Handbook.
The original announcement regarding the Tokyo event can be found at the following link: link.
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