A rapid expansion of AI data centres worldwide is driving a significant increase in demand for high‑bandwidth memory (HBM), a critical component for powering the AI accelerators used to train and operate advanced models. Although Samsung, the world’s largest memory chip producer, has lagged behind competitors such as SK Hynix in launching advanced HBM products, the company is now taking steps to close that gap.
On Wednesday, Samsung Electronics’ chief technology officer for its semiconductor division, Song Jai‑hyuk, reported that the market response to the company’s new HBM4 chips has been “very satisfactory.” The firm noted that initial production yields have been strong and achieved without requiring any design changes, thanks to its 6th-generation 10nm-class (1c) DRAM and 4nm logic die processes.
The new HBM4 memory offers a sustained processing speed of 11.7 Gbps, approximately 46% faster than the industry standard of 8 Gbps. This performance marks a 1.22-times increase over the previous generation, HBM3E, which delivered speeds of 9.6 Gbps and can be further enhanced to 13 Gbps to alleviate growing data bottlenecks. Additionally, Samsung has reported a total memory bandwidth per stack that has increased by 2.7 times compared to HBM3E, reaching up to 3.3 TB/s.
Looking ahead, Samsung anticipates that sales of its HBM products will more than triple in 2026 compared to 2025, bolstered by strong market momentum. The company is already ramping up production capacity for HBM4 to meet escalating customer demand.
Following the introduction of HBM4, Samsung plans to begin sampling its next-generation HBM4E chips in the second half of 2026, with customized HBM products expected to reach customers in 2027. This strategic rollout reflects Samsung’s intention to regain its competitive edge in the high-bandwidth memory market.
SK Hynix, currently the leading supplier of high-bandwidth memory, stated its commitment to maintaining an “overwhelming” share of the HBM4 market as competition from Samsung intensifies. The company indicated that it aims to achieve production yields for HBM4 that are comparable to those of its existing HBM3E chips.
This escalating competition in the HBM market underscores the broader trend of technological advancements fueled by AI. As the demand for powerful memory solutions continues to surge, companies like Samsung and SK Hynix are poised to play crucial roles in shaping the future of artificial intelligence and its applications across various industries.
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