Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced a high-current-density quad-phase power module designed to address the increasing power demands of advanced AI data centers. The new TDM24745T OptiMOS™ module integrates four power stages, a TLVR (trans-inductor voltage regulator) inductor, and decoupling capacitors into a compact 9 x 10 x 5 mm³ package. It achieves a current density exceeding 2 A/mm², marking a significant advancement in power delivery technology suitable for next-generation AI accelerators.
“As AI workloads scale at unprecedented speed, the need for highly efficient and extremely compact power delivery has never been greater,” stated Athar Zaidi, Senior Vice President and General Manager Power ICs and Connectivity at Infineon. He emphasized that the TDM24745T redefines high-current voltage regulation by combining exceptional current density with TLVR technology in a small footprint, allowing customers to enhance compute performance, reduce energy consumption, and facilitate the rapid deployment of next-generation AI data centers.
As power requirements within AI data centers continue to escalate, there is a pressing need for more compact, responsive, and efficient power architectures. The TDM24745T tackles these challenges by streamlining power architecture design and enabling higher power density, which frees up PCB space for additional computing resources. Remarkably, the TLVR architecture can cut required output capacitance by up to 50 percent, which aids system designers in creating more efficient, space-conserving layouts that contribute to energy savings and improved total cost of ownership (TCO) across AI server platforms.
The TDM24745T is distinguished as the industry’s first TLVR quad-phase module in this compact form factor, boasting a peak current capability of up to 320 A. This feature makes it particularly suitable for advanced AI processors and high-current multiprocessor platforms. When combined with Infineon’s digital multiphase controllers, the module supports flexible and scalable architectures that can expedite system deployment in the fast-evolving landscape of AI.
Powered by OptiMOS-6 MOSFET technology along with chip-embedded integration and proprietary magnetics, the TDM24745T enhances efficiency and thermal performance even in the most densely packed AI server designs. This advancement is crucial in developing more energy-efficient AI factories, responding to the growing demand for sustainable technology solutions.
The module integrates smoothly into Infineon’s comprehensive AI server power delivery ecosystem, which extends from the grid interface to core processor rails. By leveraging a combination of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, Infineon offers a scalable approach to achieving the highest efficiency, robustness, and power density for AI-optimized data center architectures.
Availability
Further information on the TDM24745T OptiMOS quad-phase power module can be accessed through official channels.
The company will spotlight its innovations during the Infineon We Power AI Day, an industry event taking place in Taipei on March 31. This gathering will bring together business and technology leaders to explore the latest advancements in power technologies. The focus will be on creating a sustainable AI infrastructure enabled by Infineon’s solutions, ranging from grid connections to core processing capabilities.
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